IBM Announces Networking Alliance with 3Com Corp.

WHITE PLAINS, N.Y. July 27... IBM announces today an agreement between its
Networking Hardware Division and the 3Com Corp for a development,
manufacturing and marketing pact in the rapidly growing field of
enterprise networking.

The agreement was reached between IBM and 3Com in response to 3Com's
planned acquisition of Chipcom Corp., which was also announced today.

The terms of the IBM-3Com agreement preserve the development, manufacturing
and marketing alliance that IBM had with Chipcom and which will now be
honored by 3Com. In addition, IBM and 3Com are announcing their intention
to expand that agreement into new product areas and to explore additional
opportunities for cooperation in the field of networking.

IBM and 3Com will ensure the continuity of product delivery and solutions
for IBM customers. Both companies plan to continue to enhance customer
solutions with improvements in technology. The expertise of 3Com in
Ethernet and Fast Ethernet technology combined with IBM's leadership in
Token Ring and ATM forms a powerful partnership to meet customers'
internetworking needs.

"IBM's development, manufacturing and marketing partnership with Chipcom
has enabled us both to offer leadership campus networking solutions to our
customers. IBM has also had a very successful OEM relationship with 3Com.
The merger of these two business partners will allow us to leverage the
advantages of both of these alliances for the benefit of our customers,"
said William R. (BJ) Johnson, Jr., general manager, IBM Networking
Hardware Division.

The IBM Networking Hardware Division develops and manufactures leading-edge
technology and solutions in the enterprise networking arena. The division,
headquartered in White Plains, N.Y., with major facilities in Research
Triangle Park, N.C. and La Gaude, France, also provides education,
consultation, service and support functions to help customers achieve
their business objectives.
 
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